ATEC Capabilities | Semiconductor Assembly & Testing

Full-Service OSAT & Reliability Testing

We are a certified Outsourced Semiconductor Assembly and Test (OSAT) provider specializing in full turn-key semiconductor services, all managed in-house for quality control, speed, and reliability.

Packaging & Assembly

We support a wide range of device and package types:

Supported Packages
- SOIC NB, SOIC WB, eSOIC, SSOP, SOT23, TSOT23
- TSSOP, PDIP, QFN/TDFN, TO39, LGA, DMP
- SMD-PLCC, Mini SMD, SOD323
- Custom packages: leadframe based, ceramic based, or PCB based

Core Processes
- Wafer backgrind and wafer probe
- Dicing for Si, GaN, SiC
- Epoxy die attach and eutectic die attach (leadframe and substrate)
- Copper, gold, and aluminium wire bonding
- Molding, laser marking, singulation, trim and form
- Final test

‍

Plating Capabilities

We support a wide range of device and package types:

In-house plating for leadframes, substrates, and interconnects

JEDEC-compliant finishes for solderability and corrosion resistance
Custom finish options with SPC-monitored process control
- Tin (Sn) and Matte Tin
- Tin-Silver (SnAg)

‍

Wafer Probe & Final Test

Wafer probing analog, digital, mixed-signal
Functional, parametric, and electrical testing
AEC-Q100 qualification for automotive-grade devices

Reliability & Failure Analysis

Failure analysis using physics-of-failure (PoF)
Autoclave, Temp Cycle, High Temp Storage/Bake, Precon
HALT/HASS, delamination, cross-section, ESD
Accelerated stress testing and reliability audits
Burn-in and high-reliability screening HTOL, Temp Cycle, HAST

Partial Services

We understand that some projects only require specific process steps. That’s why at ATEC we offer partial services with the same process control and quality standards as our full turn-key OSAT solutions.

Wafer Probe

Analog, digital, and mixed-signal wafer probing
Parametric, functional, and electrical testing
Die-level screening and yield analysis
Support for process characterization
Data collection for downstream assembly and test

‍

Wafer Saw

Precision wafer dicing for Si, GaN, and SiC
Controlled kerf width and cut accuracy
Low-stress sawing to minimize die chipping and cracking
Support for various wafer thicknesses and formats
Optimized for assembly and packaging compatibility

Backgrind

Wafer thinning to customer-defined specifications
Tight control of total thickness variation (TTV)
Stress and surface damage minimization
Support for standard and advanced packaging flows
In-process inspection and monitoring

‍

Plating

In-house plating for leadframes and substrates
JEDEC-compliant finishes for solderability and corrosion resistance
SPC-monitored process control
Supported finishes:
- Tin (Sn)
- Matte Tin
- Tin-Silver (SnAg)

Captive Line Model

Our Captive Line Model offers you full process ownership with traceability and scheduling control.

Key Benefits of Captive Line Model

No line-sharing reduces variability and increases consistencyGreater process visibility and securityOptimized for high-reliability, high-complexity productsIdeal for automotive, medical, and defense applications

Logistics, Warehousing & Drop Shipment

We provide global logistics support and secure warehousing to streamline your supply chain.

Logistics Services

Material procurement and supply chain management
Inventory storage at our secure warehouse
Drop shipment to OEMs and CMs worldwide
End-customer labeling and just-in-time (JIT) delivery

Engineering Support & Product Development

Together we develop products from design to volume ramp with engineering services that improve quality, test coverage, and manufacturing performance.

Development Support

Die sourcing and package recommendations
Prototype builds and process qualification
Design for Manufacturing (DFM) consulting
Design for Reliability (DFR) planning and testing

Test Engineering & Correlation

Custom test program development
Test platform conversion and validation
Test correlation, FA tracking, and yield improvement
Partner-driven approach for long-term reliability

Facilities, Equipment & Certifications

Our internationally certified manufacturing facility in the Philippines is designed to support volume production and high-reliability demands.

Facility Highlights

Class 1K/10K/100K cleanroom
ESD Controlled
Quality Controlled Processes
End to end Manufacturing Systems
Fool-proof Traceability Controls
Environmental Social and Governance (ESG)

Quality Systems & Certifications

IATF 16949 – Automotive Quality Management
ISO 9001 – Quality Management Systems
ISO 14001 – Environmental Management Systems
VDA 6.3 – Audited by direct and indirect global customers

About Us

Why Partner with ATEC?

We are your strategic manufacturing partner, offering:

Seamless End-to-End Solutions

Offering full OSAT coverage, warehousing, logistics coordination, and global drop shipment.

Certified Automotive Expertise

Decades of experience in delivering automotive-certified semiconductor manufacturing solutions.

Responsive Customer Support

Direct collaboration with technical experts for clear communication.

Global Standards, Local Agility

Philippine-based manufacturing with international certifications and quality benchmarks.

Shared Values, Shared Success

Our culture is rooted in collaboration, accountability, and pride in delivering world-class results for our partners.

Learn More About ATEC

What sets us apart

Reliable Semiconductor Assembly & Testing