Assembly Process Capability

ATEC is driven by our vision of being a strategic partner to our customers.

We provide a full array of semiconductor assembly and test services, ranging from discretes to complex multichip packages, from low volume, quick turns to high volume production.

Our Multichip Packaging Solutions has made us specialists in the non-standard semiconductor processes and packages.

Our Open Line Production (i.e., PDIP, SOIC, eSOIC, SOT23, TSSOP, QFN/DFN, Air Cavity Plastic QFN, TO39) provides our customers with consistent quality, fast cycle time, timely delivery and competitive/reasonable cost.

Our Captive Line Production provides the customer a cost-effective alternative of having their own line inside ATEC.  It is an ultimate answer to our customers’ requirement for higher efficiency, dedicated resource, faster production line responsiveness and a guaranteed capacity.

ATEC offers a wide range of technical assembly process capabilities. Operating in a Class 1K, 10K and 100K clean room environment using state-of-the-art equipment applying our capabilities at die preparation, front-of-line, end-of-line and test and T&R operations.

Our Assembly and Test Process Capabilities