Providing World-Class Assembly and Test Services for the Semiconductor and Electronics Industry
- Our MULTICHIP PACKAGING has made ATEC a specialist in the non-standard semiconductor packages and processes.
- Our STANDARD PRODUCT LINES (SOT / SOIC / QFN) provide our customers with consistent quality, fast cycle time, timely delivery, and lower costs.
- Our CAPTIVE LINES provide the ultimate answer to our customers’ requirements for higher efficiency, faster production line responsiveness, and guaranteed capacity.
- Our CORE TEAM of experts who strongly support our operations bring with them an average of 24 years of industry experience.
- Our WORKFORCE consists of over 800 multi-skilled, continuously trained employees, who are also proficient in English.
- Our PRODUCT RANGE includes MCP, MCM, Hybrid with SMT, COB, optoelectronic devices, SMT assemblies, and discrete packages assembly.
Your strategic partner now and into the future.
ATEC offers diverse package formats and sizes to serve the wide range portfolio of world-class semiconductor manufacturers, from lead frame IC packages for through-hole and surface mounting to the multichip solutions and stacked die circuits assembly, and from legacy devices to tomorrow’s system in package solutions.
Technology and Engineering
Innovation has always been one of the focus areas of ATEC. As a global semiconductor product and service provider, ATEC aims to help its partners to support technical and packaging capabilities in their specific industries. ATEC provides solutions and other services to its valued partners that aim to contribute business objectives on top of maintaining high quality integrated circuit (IC) package. Certified to ISO 9001, IATF16040 and ISO 14001.
ATEC is capable of providing services to its valued partners extending collaborative development that listen to customer requirement and work together to establish the concept. Innovate packaging and offers process solutions; customize products requiring non-standard processes. Its expertise ranges from standard package design, customized packages, and copper wire bonding platform among other capabilities.
ATEC offers engineering operations services to support its valued partners. These services are designed to offer different packaging capabilities and management of production line that entails standard and customized processes to meet the needs of our partners. ATEC is dedicated in providing value and building long term relationships with its partners by maximizing resources, cost efficiency, excellent quality and helping businesses achieve their operations objectives with awesome customer experience